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OEM China Box Header - 236-F MB102 830 Poles Solderless Breadboard – J-Guang

OEM China Box Header - 236-F MB102 830 Poles Solderless Breadboard – J-Guang Featured Image
  • OEM China Box Header - 236-F MB102 830 Poles Solderless Breadboard – J-Guang

Katrangan singkat:

J-GUANG breadboard nduweni telung jinis: breadboard solderless umum, solderless transparent, breadboard kombinasi. Padha duwe loro packing: kothak packing lan tray packing, kita bisa Pack barang miturut syarat pelanggan. Spesifikasi Tegangan Tahan Dielektrik: AC 500V Per Menit. Ketahanan Isolasi: 1000MΩ Min Ketahanan Kontak: 100mΩ Kisaran Suhu Maks: -20°C~+80°C Bahan Isolator: Termoplastik


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OEM China Box Header - 236-F MB102 830 Poles Solderless Breadboard – J-Guang Detail:

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J-GUANG breadboard nduweni telung jinis: breadboard solderless umum, solderless transparent, breadboard kombinasi. Padha duwe loro packing: kothak packing lan tray packing, kita bisa Pack barang miturut syarat pelanggan.

Spesifikasi

Tegangan Tahan Dielektrik: AC 500V Per Menit.

Resistansi Isolasi: 1000MΩ Min

Resistansi Kontak: 100mΩ Maks

Kisaran Suhu: -20°C~+80°C

Materi

Isolator: termoplastik

JG236-F

Gambar detail produk:

OEM China Box Header - 236-F MB102 830 Poles Solderless Breadboard – Gambar detail J-Guang

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